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SC1302A/B/C/D/E/F
Dual High Speed Low-Side MOSFET Driver
POWER MANAGEMENT Features
Operating Voltage -- +4.5V to +16.5V Fast rise and fall times (20ns typical with 1000pf load) Dual MOSFET driver Peak drive current -- 2A propagation delay -- 40ns 8-pin SOIC / MSOP lead free packages. This product is fully WEEE and RoHS compliant Enable/disable control TTL-compatible input Under voltage lockout with hysteresis Low shutdown supply current Over temperature protection ESD protection Dual inverting/non-inverting and inverting/non-inverting configurations
Description
The SC1302A/B/C/D/E/F family are low cost dual low-side MOSFET drivers. These drivers accept TTL-compatible inputs and are capable of supplying high current outputs (> 2A peak) to external MOSFETs. Fast switching allows operation up to 1 MHz. The SC1302A/B/C is available in six configurations: SC1302A is a dual non-inverting, SC1302B is a dual inverting and SC1302C alone has an inverting plus one non-inverting output. The SC1302D/E/F is the derivative part from SC1302A/B/C with pin 1 (EN) and pin 8 (SHDN) internally tied to VCC. An under-voltage lockout circuit guarantees that the driver outputs are low when Vcc is less than 4.5V (typical). An internal temperature sensor shuts down the driver in the event of over temperature.
Applications
Switch-mode power supplies Battery powered applications Solenoid and motor drives
Typical Application Circuit
July 13, 2009
(c) 2009 Semtech Corporation
1
SC1302A/B/C/D/E/F
Pin Configuration
SC1302A/D (Dual Non-Inverting)
Ordering Information
Device
SC1302AISTRT SC1302BISTRT SC1302CISTRT SC1302DSTRT SC1302ESTRT SOIC-8 -40C to +125C
Package
Temperature Range (TJ)
8-Pin SOIC (A/D) or MSOP (A only) SC1302B/E (Dual Inverting)
SC1302FSTRT SC1302AIMSTRT SC1302BIMSTRT SC1302CIMSTRT Notes: (1) Available in tape and reel only. A reel contains 2,500 devices. (2) Lead-free package only. Device is WEEE and RoHS compliant. MSOP-8 -40C to +125C
8-Pin SOIC (B/E) or MSOP (B only) SC1302C/F (Inverting+Non-Inverting)
Top Marking Information
SOIC A/B/C
8-Pin SOIC (C/F) or MSOP (C only)
Top Marking Information
MSOP A/B/C
X=A, B, C yyww = Date Code SOIC D/E/F
X=A, B, C 302A = SC1302A yyww = Date Code
X=D, E, F yyww = Date Code
2
SC1302A/B/C/D/E/F
Absolute Maximum Ratings
Supply Voltage VCC (V) . . . . . . . . . . . . . . . . . . . . . . -0.3 to +20 Input Voltages (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to VCC Peak Output Currents (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Enable Voltage SC1302A/B/C (V) . . . . . . . . . . . -0.3 to VCC Shutdown Voltage SC1302A/B/C (V) . . . . . . . . -0.3 to VCC Continuous Power Dissipation (W). . . . . . Internally limited ESD Protection Level (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Recommended Operating Conditions
Operating Temperature Range (C) . . . . . . -40 < TJ < +125 Operating Supply Voltage (V) . . . . . . . . . . . . . . . -0.3 to 16.5
Thermal Information
Thermal Resistance, Junction to Ambient MSOP (C/W). .206 Thermal Resistance, Junction to Ambient SIOC (C/W) . . .165 Maximum Junction Temperature (C) . . . . . . . . . . . . . . +150 Storage Temperature Range (C) . . . . . . . . . . . -65 to +150 Lead Temperature (Soldering)10s (C) . . . . . . . . . . . . . +260
Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended.
DC Electrical Characteristics
Unless otherwise specified, -40C < TA = TJ <125C, VCC = 12V, VIN = 5V, VEN =5V (SC1302A/B/C), VSHDN = 5V (SC1302A/B/C)
Parameter
Supply Current Quiescent Current Quiescent Current Quiescent Current Under-Voltage Lockout Threshold Voltage Hysteresis Enable for SC1302A/B/C Enable Voltage Disable Voltage Delay to Output(1) Delay to Output(1) Enable Input Current
Symbol
Conditions
Min
Typ
Max
Units
IQ IQ IQ
VCC < VSTART VEN = VSHDN = 3V for SC1302A/B/C, VINA = VINB = 3V VSHDN = 0V for SC1302A/B/C
1 5.7 3
1.8 8.1 8
mA mA A
VSTART
VSHDN = VEN = 3V for SC1302A/B/C, VINA = VINB = 3V VSHDN = VEN = 3V for SC1302A/B/C, VINA = VINB = 3V
4.2 250
4.5 320
4.7 475
V mV
VEN VEN tD_EN tD_DIS IEN
0 < VEN < VCC 0 < VEN < VCC EN from low to high EN from high to low 0 < VIN < VCC
2.0 0.8 70 55 10 14 19
V V ns ns A
3
SC1302A/B/C/D/E/F
Electrical Characteristics (continued)
Unless otherwise specified, -40C < TA = TJ <125C, VCC = 12V, VIN = 5V, VEN =5V (SC1302A/B/C), VSHDN = 5V (SC1302A/B/C)
Parameter
Input High Level Input Voltage Low Level Input Voltage
Symbol
Conditions
Min
Typ
Max
Units
VIH VIL
0 < VIN < VCC 0 < VIN < VCC 0 < VIN < VCC, Non-inverting Input(s) of SC1302A/C/D/F
2.0 0.8 13 18.5
V V A
Input Current
IIN
0 < VIN < VCC, Inverting Input(s) of SC1302B/C/E/F
-8
A
Output IPK_SOURCE Output Peak Current IPK_SINK Shutdown for SC1302A/B/C SHDN Input Voltage High SHDN Input Voltage Low SHDN Pin current Thermal Shutdown Over Temperature Trip Point (1) Hysteresis (1) TJ_OT 150 10 C C VSHDN VSHDN ISHDN VSHDN = 5V 32 2 0.3 40 V V A VOUT = VCC - 0.5V, tPW < 10 s 1600 mA VOUT = 0.5V, tPW < 10 s 1600 mA
AC Electrical Characteristics
Unless otherwise specified, TA = TJ = 25C, VCC =12V, VEN = 5V, CL = 1000pF
Parameter
Rise Time(1) Fall Time(1) Propagation Delay Time(1) Propagation Delay Time(1)
Symbol
tR tF tD1 tD2
Conditions
See Timing Diagram See Timing Diagram TA = -40C ~ 125C TA = -40C ~ 125C
Min
Typ
20 20 53 41
Max
Units
ns ns
70 60
ns ns
Notes: (1) Guaranteed by design (2) Negative sign indicates that the input current flows out of the device.
4
SC1302A/B/C/D/E/F
Typical Characteristics
Rise and Fall Time vs. Supply Voltage
25 CL = 1000pF; TA = 25C
80
Rise and Fall Time vs. Capacitive Load
VCC = 12V; f = 200kHz; TA = 25C
60
20
Time (ns)
Time (ns)
tf
40
tf tr
tr 15
20
10
4
8
12 Supply Voltage (V)
16
0
100
1000 Capacitive Load (pF)
10000
Supply Current vs. Capacitive Load
40 VCC = 12V One Driver Running; TA = 25C
15
Input Pin Current
30
Supply Currnt (mA)
10
Non-inverting
5
20
IIN (uA)
0
Inverting
10
200kHz
-5
100kHz 0 100
-10 8 VIN (V)
1000 Capacitive Load (pF)
10000
0
4
12
5
SC1302A/B/C/D/E/F
Pin Descriptions
Pin #
1
SC1302A/D SC1302B/E SC1302C/F
EN/NC EN/NC EN/NC
Pin Function
Enable/Disable Control -- When the EN is driven low, both outputs are low. When left open, both outputs are low. Enable both drivers by tying EN pin to a voltage greater than 2V. No connection on versions D, E, and F. TTL compatible input to driver A -- When left open, Pin 7 is low. Ground connection TTL compatible input to driver B -- When left open, Pin 5 is low. Output gate drive B for external MOSFET Supply: +4.5V to +16.5V supply. During UVLO the outputs are held low. Output gate drive A for external MOSFET Shutdown pin -- Apply a voltage from 2V to VCC to enable device. Pull below 0.3V for low-power shut down. No connection on versions D, E, and F.
2 3 4 5 6 7 8
INA GND INB OUTB VCC OUTA SHDN/NC
INA GND INB OUTB VCC OUTA SHDN/NC
INA GND INB OUTB VCC OUTA SHDN/NC
6
SC1302A/B/C/D/E/F
Block Diagram
SC1302A
EN VCC
SC1302B
INA BIAS
PRE DRIVER
OUTA
SHDN
BANDGAP
BIAS INB PREDRIVER OUTB
GND
SC1302C
SC1302D
VCC
INA BIAS
PRE DRIVER
OUTA
BANDGAP
BIAS INB PREDRIVER OUTB
GND
SC1302E
SC1302F
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SC1302A/B/C/D/E/F
Applications Information
General Description
The SC1302A/B/C/D/E/F is a high speed, high peak current dual MOSFET driver. It is designed to drive power MOSFETs with ultra-low rise/fall time and propagation delays. As the switching frequency of PWM controllers is increased to reduce power converters volume and cost, fast rise and fall times are necessary to minimize switching losses. While a discrete solution can achieve reasonable drive capability, implementing delay and other housekeeping functions necessary for safe operation can become cumbersome and costly. The SC1302A/B/C/D/E/F presents a total solution for the high-speed, high-power density applications. Wide input supply range of 4.5V to16.5V allows use in battery powered applications as well as distributed power systems. For simplicity, it is assumed that the gate capacitance of a MOSFET is constant. The power delivered from the power supply can be estimated based on this simplification. The energy needed to charge the capacitor is given by the following equation
E ON 1 C V2 2
where C is the load capacitance and V is the output voltage swing of the driver. During turn off, the same amount of energy is dumped to the ground. Therefore, the energy dissipated in one switching cycle is: ETOTAL = C x V2 The power dissipation due to the gate driving actions is given by: PGATE = f x C x V2 where, f is the switching frequency. With VCC = 12V, C = 1nF and f = 200kHz, the power dissipation per output is: PGATE =(200kHz) x (1nF) x (12)2 = 29mW The corresponding supply current is:
I PGATE VCC 29mW 12 V 2.4mA
Supply Bypass and Layout
A 4.7F to 10F tantalum bypass capacitor with low ESR (equivalent series resistance) and an additional 0.1F ceramic capacitor in parallel are recommended as a supply bypass to control switching and supply transients. As with any high speed, high current circuit, proper layout is critical in achieving optimum performance of the SC1302A/B/C/D/E/F. Attention should be paid to the proper placement of the driver, the switching MOSFET, and the bypass capacitors. The driver should be placed as close as possible to the external MOSFETs to eliminate the possibility of oscillation caused by trace inductance and the MOSFET gate capacitance. A resistor in the range of 10ohm could be used in series with the gate drive to damp the ringing if the drive output path is not short enough. The bypass capacitors should also be placed closely between VCC and GND of the driver. A Schottky diode may be used to connect the ground and the output pin to avoid latch-ups in some applications.
Thermal Information
The driver's junction temperature must be kept within the rated limit at any time. The application system has to effectively remove the heat generated in the driver in order for proper functions and performance. If the junction temperature reaches 150C, the internal protection circuit will be triggered to shut down the gate driver. The power dissipation of the SC1302A/B/C/D/E/F should be derated according to the following formula:
PowerDissipation 125 C T A jA
Drive Capability and Power Dissipation
The SC1302A/B/C/D/E/F is able to deliver 1.6A peak current for driving capacitive loads, such as MOSFETs. Fast switching of the MOSFETs significantly reduces switching losses for high frequency applications. Thermal stress is reduced and system reliability is improved.
where TA = ambient temperature.
8
SC1302A/B/C/D/E/F
Timing Diagram
5V
90%
Input
0V
10% tR tF 90% 90% 10%
Non - inverting Output SC1302A 10%
Inverting Output SC1302B 90%
tF
tR 90% 10%
10% t D2
t D1
9
SC1302A/B/C/D/E/F
Outline Drawing -- MSOP-8
DIMENSIONS e/2 A N 2X E/2 E1 E D DIM A A1 A2 b c D E1 E e L L1 N 01 aaa bbb ccc INCHES MIN .000 .030 .009 .003 .114 .114 NOM MAX .043 .006 .037 .015 .009 .122 .122 MILLIMETERS MIN 0.00 0.75 0.22 0.08 2.90 2.90 NOM MAX 1.10 0.15 0.95 0.38 0.23 3.10 3.10
PIN 1 INDICATOR ccc C
.118 .118 .193 BSC .026 BSC .016 .024 .032 (.037) 0 8 .004 .005 .010 8
3.00 3.00 4.90 BSC 0.65 BSC 0.40 0.60 0.80 (.95) 0 8 0.10 0.13 0.25 8
12 e B
2X N/2 TIPS
aaa SEATING PLANE
C
D A2 A1 bxN bbb C A-B D A
H c
C
GAGE PLANE 0.25 (L1) DETAIL A L
01
SIDE VIEW NOTES: 1. 2. 3. 4.
SEE DETAIL A
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS -AAND -BTO BE DETERMINED AT DATUM PLANE -H-
DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. REFERENCE JEDEC STD MO-187, VARIATION AA.
10
SC1302A/B/C/D/E/F
Land Pattern -- MSOP-8
X
DIMENSIONS DIM C (C) G Z G P X Y Y P Z INCHES (.161) .098 .026 .016 .063 .224 MILLIMETERS (4.10) 2.50 0.65 0.40 1.60 5.70
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
11
SC1302A/B/C/D/E/F
Outline Drawing -- SO-8
DIMENSIONS A N 2X E/2 E1 E e D DIM A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc A2 SEATING PLANE A h INCHES MIN .053 .004 .049 .012 .007 .189 .150 NOM MAX .069 .010 .065 .020 .010 .197 .157 MILLIMETERS MIN 1.35 0.10 1.25 0.31 0.17 4.80 3.80 NOM MAX 1.75 0.25 1.65 0.51 0.25 5.00 4.00
1 ccc C 2X N/2 TIPS
2 e/2 B
.193 .154 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 0 8 .004 .010 .008 8
4.90 3.90 6.00 BSC 1.27 BSC 0.25 0.50 1.04 0.40 0.72 (1.04) 0 8 0.10 0.25 0.20 8
D aaa C
C bxN bbb
A1 C A-B D GAGE PLANE 0.25 SEE DETAIL A SIDE VIEW
H
h
c
L (L1) DETAIL A
01
NOTES: 1. 2. 3. 4. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS -AAND -BTO BE DETERMINED AT DATUM PLANE -H-
DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. REFERENCE JEDEC STD MS-012, VARIATION AA.
12
SC1302A/B/C/D/E/F
Land Pattern -- SO-8
X DIMENSIONS DIM C (C) G Z G P X Y P Y Z INCHES (.205) .118 .050 .024 .087 .291 MILLIMETERS (5.20) 3.00 1.27 0.60 2.20 7.40
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A.
Contact Information
Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111 Fax: (805) 498-3804 www.semtech.com
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